Waferscale Integration of Photonics and Electronics
The WIPE project is about researching new technologies for connecting micro-photonic integrated circuits (PIC’s) and micro-electronic integrated circuits (IC’s) in a most advanced way, enabling
- Better performance
- Faster design and manufacturing
- Lower price
of new photonic components which will form the core elements in a wide variety of applications which make life better, e.g.
- Ultra-high speed data communication for the next generation Internet
- Extremely sensitive detectors for gasses, temperatures or strain in mechanical structures securing our environment and safety
- New biomedical analysis devices for a quick diagnosis of diseases