The following papers and conference contributions were published in the context of the WIPE project:

1) Xiao Liu, Xi Zhang, Marc Spiegelberg, Marion Matters-Kammerer, J.J.G.M. (Jos) van der tol, “Photonic Electronic Integration at Wafer Scale”, ICT.OPEN conference, 22.03.2016, Amersfoort, the Netherlands.
2) Spiegelberg, M. , La Porta, A.D., Offrein, B.J. , Dolores Calzadilla, V.M. , van der Tol, J.J.G.M. and Williams, K.A. “Optical coupler concept for wafer scale fabrication of adhesively bonded photonic and electronic circuits”. In: G. Roelkens, N. Le Thomas & P. Bienstman (Eds.), Proceedings of the 21st Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 17-18, 2016, Gent, Belgium (pp. 215-218). Gent: Universiteit Gent.
3) B.J. Offrein, “Driving down the cost of datacenter photonics applying novel scalable integration concepts”, PIC International Conference, 07.03.2107, Brussels, Belgium (Invited).
4) B.J. Offrein, T. Barwicz, P. Fortier, “Scalable Electro-optical Assembly Techniques for Silicon Photonics”, OIDA Workshop on Manufacturing Trends for Integrated Photonics, OFC 2017, 19.03.2017, Los Angeles, CA, USA. (Invited).
5) Xi Zhang, Xiao Liu, M.K. Matters-Kammerer, “Wafer scale Integration of Photonics and Electronics”, ICT.OPEN conference, 21.03.2017, Amersfoort, the Netherlands.
6) B.J. Offrein, “Scalable electro-optical packaging of silicon photonics components”, Swissphotonics Workshop on Miniaturized Photonic Packaging, CSEM Alpnach, 16.05.2017, CSEM, Alpnach, Switzerland (Invited).
7) B.J. Offrein, “Elektro-optische Integrationstechnologien für optische Kommunikation in Rechenzentren”, Kolloquium NTB, 30.05.2017, NTB Campus Buchs, Switzerland (Invited.
8) A.D. La Porta, R. Dangel, D. Jubin, N. Meier, F. Horst, and B.J. Offrein, “Scalable and Broadband Silicon Photonics Chip to Fiber Optical Interface Using Polymer Waveguides”, IEEE Optical Interconnects Conference 2017, 06.06.2017, Santa Fe, NM, USA (presentation and conference paper).