The following papers and conference contributions were published in the context of the WIPE project:

1) Xiao Liu, Xi Zhang, Marc Spiegelberg, Marion Matters-Kammerer, J.J.G.M. (Jos) van der tol(), “Photonic Electronic Integration at Wafer Scale”, ICT.OPEN conference, 22.03.2016, Amersfoort, the Netherlands.
2) Spiegelberg, M. , La Porta, A.D., Offrein, B.J. , Dolores Calzadilla, V.M. , van der Tol, J.J.G.M. and Williams, K.A. “Optical coupler concept for wafer scale fabrication of adhesively bonded photonics and electronics circuits”. In: G. Roelkens, N. Le Thomas & P. Bienstman (Eds.), Proceedings of the 21st Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 17-18, 2016, Gent, Belgium (pp. 215-218). Gent: Universiteit Gent.
3) B.J. Offrein, “Driving down the cost of datacenter photonics applying novel scalable integration concepts”, PIC International Conference, 07.03.2107, Brussels, Belgium (Invited).
4) B.J. Offrein, T. Barwicz, P. Fortier, “Scalable Electro-optical Assembly Techniques for Silicon Photonics”, OIDA Workshop on Manufacturing Trends for Integrated Photonics, OFC 2017, 19.03.2017, Los Angeles, CA, USA. (Invited).
5) Xi Zhang, Xiao Liu, M.K. Matters-Kammerer, “Wafer scale Integration of Photonics and Electronics”, ICT.OPEN conference, 21.03.2017, Amersfoort, the Netherlands.
6) B.J. Offrein, “Scalable electro-optical packaging of silicon photonics components”, Swissphotonics Workshop on Miniaturized Photonic Packaging, CSEM Alpnach, 16.05.2017, CSEM, Alpnach, Switzerland (Invited).
7) Antonio La Porta, Roger Dangel, Daniel Jubin, Norbert Meier, Folkert Horst and Bert Jan Offrein, “Scalable Optical Coupling between Polymer Waveguides and a Silicon Photonics Chip”, Photonics & Opto-Electronics Packaging Conference, 23.11.2016, Heriot Watt University – Edinburgh, UK (Invited presentation).
8) Antonio La Porta, “Optical interconnects: Photonics at service of Electronics”, 1st International school of the IEEE Photonics Society – Italy chapter on “Photonics Integration: advanced materials, new technologies and applications”, E. Majorana Centre for Scientific Culture, Erice (TP) Italy.
9) B.J. Offrein, “Elektro-optische Integrationstechnologien für optische Kommunikation in Rechenzentren”, Kolloquium NTB, 30.05.2017, NTB Campus Buchs, Switzerland (Invited).
10) A.D. La Porta, R. Dangel, D. Jubin, N. Meier, F. Horst, and B.J. Offrein, “Scalable and Broadband Silicon Photonics Chip to Fiber Optical Interface Using Polymer Waveguides”, IEEE Optical Interconnects Conference 2017, 06.06.2017, Santa Fe, NM, USA (presentation and conference paper).
11) K.A. WilliamsProspects for Electronic Photonic Integration”, Proceedings Integrated Photonics Research Silicon and Nano Photonics (IPR), july 2017, New Orleans, LA, USA (invited paper).
12) Antonio La Porta, Roger Dangel, Daniel Jubin, Norbert Meier, Folkert Horst and Bert Jan Offrein, “Broadband High Channel Count Optical Fiber Interface for Silicon Photonics using Polymer Waveguides”, ECOC 2017, Goteborg, Sweden.
13) X. Yin et al, “Co-Design and Co-Integration of Photonic and Electronic Circuitry: the H2020 WIPE approach”, Asia Communications and Photonics Conference (ACP), Nov 10-13, 2017.
14) M.B.J. van Rijn, M.K. Smit, M. Spiegelberg, S. Paredes, “Heat sinking of highly integrated photonic and electronic circuits”, IEEE Photonics Benelux Conference 2017, 27.11.2017, Delft, The Netherlands (conference paper and poster)
15) Meighan, A., Wale, M.J., de Vries, T., Smalbrugge, E. & Williams, K.A., “Low resistance metal interconnection for direct wafer bonding of electronic to photonic ICs”, Proceedings of the 22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter, November 27-28, 2017, Delft, Netherlands.
16) La Porta, A., Weiss, J., Dangel, R. et al., “Broadband and scalable optical coupling for silicon photonics using polymer waveguides”, Advanced Optical Technologies 7(12), pp 107-113.
17) R. Dangel et al., “Polymer Waveguides Enabling Scalable Low-Loss Adiabatic Coupling for Silicon Photonics”, IEEE Journal of Selected Topics in Quantum Electronics vol 24 no 4, pp 1-11, Jul-Aug 2018.
18) Jos van der Tol, New Wold Dawning: Electrons and Photons team up, general introduction to the WIPE project. LinkedIn article, April 2018
19) Karen Solis-Trapala, Inside Wipe, the advantages of the heterogenous WIPE technology for tele- and datacom. LinkedIn article, June 2018
20) Johan Bauwelinck, How photonic and electronic IC co-design can boost optical transceiver performance, LinkedIn article, August 2018
21) Jos van der Tol, Technology Steps for Wafer-Scale Integration, LinkedIn article, October 2018
22) J.J.G.M. van der Tol(), Hybrid integration of photonics and electronics using wafer scale polymeric bonding techniques, DCI workshop at the Photonic in Switching and Computing 2018, Limassol, Cyprus